Chiplet Revolution: A Buyer’s Guide to Modular Processors, Packaging, and Trade-Offs
The chiplet revolution is reshaping how processors are designed, manufactured, and deployed. As transistor scaling becomes more challenging, chipmakers are moving from single, monolithic dies to modular, multi-die assemblies that stitch specialized pieces together. That shift unlocks performance and cost advantages while introducing new design trade-offs worth understanding for buyers, builders, and architects. What chiplets […]